iFixit Thermal Paste

Thermal paste forms a continuous, conductive layer between a processor and its heat sink, improving cooling performance and keeping your important chips from overheating.

Whenever you remove a heat sink, it’s very important to remove the old thermal paste and apply a new layer.

Specifications:

• Density: 2.3 g/cm3
• Thermal Conductivity: 6.5 W/m-K
• Operation temperature Range: -30 - 150°C
• Non Electrically Conductive
• Non curing, no bleedout
• Easy application and spreadability
• A blend of carbon and ceramic particles in a silicone polymer matrix