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Hand or BGA machine

hello to all

please help me

i want to start advanced repair period and I've decided that buy WDS-720 machine for rebull or change IC or fix CPU and HDD.

Some of my friends say that only hand is enough, but according to the research I have done BGA reworking station machin like WDS-700 or WDS-720 is professional and also very delicate and accurate.

I do not have financial problem and I can pay for the device...

Please help anyone who can.

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I personally don’t work on iPhones so I can’t speak on what is the ideal rework system for them.

As far as rework in general on BGA chips: The machine is the correct way!

The issue is when you do BGA’s by hand you can’t heat the entire chip and board area evenly so when the solder cools you’ll get tension across the joints from thermal expansion/contraction differential between the chip and the board. This tugging between the thermal changes of the chip will fatigue the joints (cold solder joint). Smaller 9/12 pin devices are less likely to have the issue by hand but larger chips will!

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See the answer I posted on this questions (BGA Rework Station for IC).

A BGA machine for iPhone logic boards is complete overkill. All of the master micro-solderers do this by hand. If you want to reball a GPU on a computer motherboard, then a machine will be the proper tool.

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I agree and I would add most times a BGA rework station even for Pc boards is a borderline tool..unless one does so much work on big ICs replacements, can charge customers for a reasonable amount and has access to reliable and decently priced replacement parts it maybe be a big waste of money. What I'd like to see in the market is a tool making stencil and paste reballing a bit easier..hand reballing with bigger smartphone ICs sometimes may be frustrating, but may be it's just me..

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