Best safe tool to push film down to remove air bubbles on back side?
We have been trying to use finger pressure on a small flexible circuit to mount or stick (the adhesive backside) of flexible circuit film to a rounded surface, but have found tiny air pocket/bubbles in the adhesive that have cause failure of adhesive to hold. Wondering if there is a better blade tool that is safe for flexible circuits, that has rounded edges (not sharp edges), but can apply pressure to circuit film to smooth out and remove air bubbles, other than using a non-conductive flat blade, such as non-conductive screw driver tip. A non-conductive spudger looks like the only alternative in Ifixit, but the flat tip looks sharp. Tip blade should be small, less than 1/2 inch. -Tom
Is this a good question?