I have ylod, I bought a ylod repair kit but does not work what do I do
Ylod repair kit does not help
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Oook. So you'll have to tear down the PS3, you can purchase a heat gun pretty cheap, around $20. Heat up the cpu and gpu, and apply new thermal paste. I'm gonna be honest, I don't know if there's a difference if performance over the Arctic silver and the regular white paste
It takes a while the first couple times. Just take your time with it. Then it turns into a ten minute process
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@wedembois first you will have to remember that there are a few things that can cause the YLOD. A few of them are:
A dead or disconnected HDD
Cold-Joint between the CPU/RSX/EE(If your console has one)
A dead power supply
Corrupted NAND Flash
You most likely have issues with your GPU processor. It is a flip chip design and the issue could be the solder bumps between the IC and the substrate. A reflow might fix it for a while but even reflows are very limited. YLOD are caused by the design of the processor, not necessarily by bad or cracked solder joints. The only repair that would fix it permanently is a new BGA. Try this repair and you may have to change the approach a bit by adjusting the heat. It is a hit and miss situation and most first time failure with this is caused by not applying to much heat, whereas to much will totally remove the IC's. Anyhow, the biggest reason for failure to reflow is not enough consistent heat. There is a fine line between reflowing and absolutely melting the solder, so one needs to be aggressive without going over board. If nothing else, get a couple of temperature probes and see what heat you generate. Replace the thermal paste but remember that thermal paste alone will not prevent a YLOD. Apply it according to their specs and it should not give you any issues. You might want to contact the game console guru and see what he thinks.
Here is a very "quick and dirty" explanation of what causes most of the YLOD (and RROD on an Xbox360). It is not always a failure of the solder balls which connect the Flip Chip BGA package to the motherboard. It does happen and you can see why [ http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
As you can see the "bumps' are what actually connects the die to the substrate to make the chip complete. If these bumps fail the die does no longer make contact either he substrate and thus no contact with the circuit board. The chip has failed.
Here you can see the space where the bump has failed and no longer makes contact. We are talking microns of space here. So a bit of pressure on the top of the die potentially close the gap. Same with a reflow, it may allow some of material from the bump to reshape and starting to make contact again. The heating of cooling of the chip during use is what will eventually cause it to fail again.
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