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Step 9
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Chipworks eagerly provided us with pictures of the motherboard less than an hour into the teardown! Here is the front of the motherboard:
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Murata M2322007 WiFi Module
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Samsung Exynos 4412 quad-core A9 processor with 1 GB LP DDR2 Green Memory (K3PE7E700M-XGC2)
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Samsung KMVTU000LM eMMC(16GB)+MDDR(64MB) NAND Flash
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Intel Wireless PMB9811X Gold Baseband processor
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MAX77693 and MAX77686
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Broadcom BCM47511 Integrated Monolithic GNSS Receiver
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33ODC 2214 4TP AC
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Step 10
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Bottom of motherboard:
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Wolfson Microelectronics WM1811 stereo codec
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Skyworks SKY77604 Multi-Band Power amplifier
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Silicon Image 9244 low-power MHL Transmitter
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NXP PN544 NFC Chip.
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Infineon PMB5712 RF transceiver
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Step 12
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Some more shots of that saucy camera, including a Chipworks x-ray!
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Chipworks report that the camera has a Sony BSI sensor. Contrary to earlier reports, their initial inspection suggests it is a new sensor, and not the same one used in the iPhone 4S. The bond pad arrangement is not the same as the IMX145 found in the iPhone 4S nor is it the same as the IMX105 found in previous Samsung phones.
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Step 13
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Update: This teardown was conducted solely via Interweb, requiring us to defer judgment on a repairability score. Now that we've worked on it ourselves, we can assign it a fair score:
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Samsung Galaxy SIII Repairability Score: 8 out of 10 (10 is easiest to repair)
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The battery can be replaced without any tools.
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Very easy to open and access internal components.
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There are only 12 screws in the entire device, all standard Phillips #0 (no proprietary or security sizes).
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Smaller components (antennas, vibrator, light sensor) are modular and can be replaced individually, but are adhered to the front panel.
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The glass is fused to both the display and the display frame, increasing repair costs.
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You'll have to go through the entire phone in order to replace the front panel, since everything is built into the back of it.
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