Technique: Reflowing Xbox 360 Motherboard
Reflow the solder on your Xbox 360's motherboard.
- Author: Andrew Bookholt
- Difficulty: Difficult
Use this guide to reflow the solder on the chips that usually cause the Xbox 360 to have a Red Ring of Death (RROD) failure. You'll need the high temperature output of a heat gun to accomplish the reflow.
Reflowing the motherboard of your Xbox 360 allows the solder balls located beneath the CPU, GPU, RAM, and other chips to reconnect with their contacts on the motherboard. To safeguard against future failure, we strongly recommend installing our Red Ring of Death Fix Kit after completing the reflow.
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In the next few steps, you will use the tip of a spudger or the finger of an Xbox 360 opening tool to release the clips along the left and right sides of the bottom vent. Their locations are highlighted in red.
You will insert the tool into the holes molded into the white plastic side case pieces.
Insert the edge of a spudger between the faceplate and the outer casing near the power button.
Run your spudger along the edge of the faceplate to release the clips securing it to the front of the console.
You may also accomplish this task by using the edge of the Xbox 360 opening tool, but it may scratch the plastic case.
Alternatively, you can use your hands to carefully pull the faceplate away from the Xbox.
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