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@repoman27 i talked to Apple store employee. The SSD module used in the Apple iMac Pro can be replaced by other PCIe SSD(Apple does not recommend doing that) and the employee said it is PCIe interface which means it can not be typical NAND interface.
This is an example of BGA SSD on M.2 module https://www.anandtech.com/show/12819/the...
The T2 processor should not be NAND Flash controller here. T2 is more like a RAID controller. Refer to https://duo.com/blog/apple-imac-pro-and-... The Toshiba chip here could be a PCIe/NVMe SSD in BGA chip package(like the one in the iPhone/iPad). The physical interface between T2 and Toshiba chip could be PCIe interface. T2 processor is also used to replace TI’s SMC controller.
It is the “Digital DC-DC Multiphase Controller” solution from infineon.
https://www.infineon.com/cms/en/product/...
I guess some chips are hide under the metal shield. If you can remove the metal shielding completely, you should be able to discover more. There are GNSS, Gyro, Accel, Barometer chips not listed.
Is Micron memory LPDDR4x?
It is Qualcomm SDR845 RF transceiver, not Qualcomm SDR846
SAMSUNG makes more their own parts than Apple. The one you see here is “Qualcomm AP-based” S9+. You may check “SAMSUNG AP-based” model. SAMSUNG made their own CPU, GPU, modem, NFC, PMIC, LPDDR4x, UFS…
http://www.techinsights.com/about-techin...
From the SAMSUNG’s product link http://www.samsung.com/semiconductor/dra... , it is 48Gb LPDDR4x which should be 6GB capacity.
Qualcomm SDR845 RF Transceiver not modem. Modem is integrated in the processor.
Apple 338S00268 should be PMIC for Apple T2.
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