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What is the black tape that secures the fans to the heatsink?It seems simply to be a high-quality electrical tape, but just to be sure, could somebody take a micrometer to it? I suspect ...
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It's there! Marked "E1100", step 14, bottom left.
2x maxim chips are max98925 boosted class dg speaker amplifiers, not max989
yes, nxp pn548
F411CE6 next to circular hole = stm32f411 arm cortex-m4 microcontroller (sensor hub)
device next to camera leds is st vl6180 time of flight sensor
3x S14573797 are knowles sph mems microphones
devices in upper right corner:
1B7 TS = bosch bmi160 imu
OD8 KP = bosch bmp280 barometer
157 T522 = bosch bmm150 geomagnetic field sensor
Notice the "X" designation on the SoC, which means that it's an experimental device. TI normally sells "X" devices to customers before they've worked out all the bugs in the chip. These parts are not necessarily up to spec, which is likely why Amazon has had to underclock the processor in the Fire HD. Amazon probably thought they could save some money by using these parts, which likely come from excess stock.
Notice that the Lattice FPGA used in previous MBP models to switch the LVDS display signal between the two GPUs ("GMUX") has been replaced with a TI HD3SS212 DisplayPort switch.
Sorry to ruin the magic, but that "EMI shield" is actually the Wi-Fi antenna. The phone antenna is in the speaker enclosure removed in Step 12. The steel frame acts as a ground plane, not actually as a radiating antenna.