In fact you can switch between brands like Toshiba, Micron, etc (We've done this before on 2G and 3G iPhone at iPhoneTECH), and it's possible to upgrade to higher density memories, i.e. 128 Gbit, 256 Gbit and possible to 512 Gbit chips, it means you may upgrade to 128 GB capacity when the memories become available. That would be terrific!
K9 = NAND memory
L = MLC DDP
CG = 64 Gbit
08 = 8x
U = 2.7V~3.6V
1 = Dual nCE & Dual R/nB
M = !st Gen.
Quote from Tom Stigler:
Is Apple using Sandisk iNand chips for flash memory?
According to http://bit.ly/9AgX1T, on the right the clips are part of the frame and they're rigid. So you may open the iPad up from the LEFT SIDE.
Quote from CityZ:
Well, it's nice that you can see how the device is held together. See those dark, presumably spring-loaded clips around the edge of the display? You'll have to release them to pop the display part from the bottom case. Maybe you can use razor blades to release the clips on two adjacent sides, allow the display to be angled out? Doesn't seem easy. The bottom probably has a bit of a lip to keep each clip firmly in place. Maybe if you had an array of suction cups, you could just pull the display out with force? Worst comes to worst, you can drill a small hole through the case, adjacent to each clip, then push in the clip with a pin to release it; afterward you fill in the holes and carefully clean all the metal filings. I doubt it would be that bad: Apple themselves need a way to get in.
In the screen assembly, on the top-right, the flexible with the large connector should be the touchpanel cable to the logic board. According to our picture (http://bit.ly/9AgX1T, sorry it's in spanish) it pass through the screen assembly frame.
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@iFixit: "Empty spot for another Samsung NAND Flash?"
Yes, the format of the pins on the board correspond to an ULGA NAND Flash IC.
http://www.samsung.com/global/business/s...
It's nice to see the Home buttom can be easily repaired/replaced
Are those tabs metal?
How easily they bend?
It seems not. In fact the black rubber seal of the edge of the screen has some scratches.
They're 64Gbit MLC NAND flash.
In fact you can switch between brands like Toshiba, Micron, etc (We've done this before on 2G and 3G iPhone at iPhoneTECH), and it's possible to upgrade to higher density memories, i.e. 128 Gbit, 256 Gbit and possible to 512 Gbit chips, it means you may upgrade to 128 GB capacity when the memories become available. That would be terrific!
K9 = NAND memory
L = MLC DDP
CG = 64 Gbit
08 = 8x
U = 2.7V~3.6V
1 = Dual nCE & Dual R/nB
M = !st Gen.
The ambient light sensor and its socket to the logic board seems too huge to me. I presume it has enough room for an iSight signals.
According to http://bit.ly/9AgX1T, on the right the clips are part of the frame and they're rigid. So you may open the iPad up from the LEFT SIDE.
In the screen assembly, on the top-right, the flexible with the large connector should be the touchpanel cable to the logic board. According to our picture (http://bit.ly/9AgX1T, sorry it's in spanish) it pass through the screen assembly frame.