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iPhone 7 - U3101 Audio IC Replacement

Video Overview

  1. iPhone 7 - U3101 Audio IC Replacement, Remove U3101: step 1, image 1 of 1
    • Remove the chip cleanly, with hot air. On my Quick 861DE rework station, I use as settings 400 °C and 100L/min. For you to decide which settings you prefer, you can find the Quick 861DW on the shop.

    • Clean the tracks with a soldering iron, tin and flux. I use a tip about 1mm in diameter with my JBC Nase 2C, at 360 ° C.

    • Clean the map.

    • Inspect the card under the microscope. We can see on the picture below that a track is missing!

    • If we compare to the diagram on the PhoneBoard software;

    • We observe very clearly that we will be able to put a wire to redo this connection, focusing on R1103.

    • Take copper wire with a diameter of 0.02mm

    • Apply flux and tin the wire with an iron.

    • Scratch the trail from C12 to R1103.

    • Laminate this track with tin.

    • Solder one end of the wire to the resistor. I used a 0.01mm diameter tip.

    • Solder the wire along the previously tinned track.

    • Bring the wire into the C12 slot and try to wrap it to be sure that the chip ball will stick to it.

    • The procedure is the same for F12, H12, J12. A12 and B12 are grounded and are not used for U3101 operation, no need to jump.

    • E12 is in contact with C1, if C1 is present no need to redo the jumper. D12, G12, J11 and A5 are connected to each other, if only one is still connected the phone can work. K12, L12, M12 are "No Connection" so no need to replace.

  2. iPhone 7 - U3101 Audio IC Replacement, Reballing the U3101: step 5, image 1 of 2 iPhone 7 - U3101 Audio IC Replacement, Reballing the U3101: step 5, image 2 of 2
    • Put on some flux.

    • Take a soldering iron with tin at the end.

    • Pass over the chip to smooth the balls.

    • Clean.

    • Put on a reballing stencil.

    • Spread some soldering paste.

    • Heat with hot air to form the balls.

    • Extract the chip by pushing with a thin tweezers.

    • Check the size of the balls.

    • And we end up putting the chip back. Flow, position and solder with hot air.

    • We let the phone cool, we go back and the problem is solved!


To reassemble your device, follow the instructions in reverse order.

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Alexandre Isaac

Member since: 04/07/13

2,722 Reputation

8 Guides authored


The Repair Academy Member of The Repair Academy


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20 Guides authored


Are there any micro soldering techs that do business through the mail. I don’t have any close to my area at all that give me wholesale prices any longer, and I am in need BAD!!!! PLEASE RESPOND ASAP! I do mostly iPhones only. Sometimes there are a few oddballs and I live in MA. I need this person to start ASAP. Thanks!

Rachel Kelley - Reply

Not sure if you still need help, if you ever need anything for iphone, ipad, or Mac book board repair, try

iTechCare Zhao -

Bonjour merci pour le tuto ma question et de savoir quel type d’éteint faut utiliser. Merci

reda bereksi reguig - Reply

Holy moly, you guys are on a whole other level !!!!

Alex Campbell - Reply

Would replacing the logic board work just as well ?

Alex Campbell - Reply

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