Skip to main content

Introduction

Audio issues on iPhone 7 and iPhone 7 Plus



Since the release of the iPhone 7 and iPhone 7 Plus in 2016, we have seen many strange failures affect these models. Most of them concerned audio problems. In appearance, the phone looked in good condition, no oxidation, it was never disassembled before, no drops, no over heating and the replacement of all the usual parts, headphone jack, earphones , speakers. It did not solve not the problem.

----(NOT FINISHED)-------

Video Overview

  1. Remove the chip cleanly, with warm air. On my Quick 861DE station, I use as settings 400 °: C and 100L / min. For you to decide which settings you prefer, you can find the Quick 861DW on the shop.
    • Remove the chip cleanly, with warm air. On my Quick 861DE station, I use as settings 400 °: C and 100L / min. For you to decide which settings you prefer, you can find the Quick 861DW on the shop.

    • Clean the tracks with a soldering iron, tin and flux. I use a tip about 1mm in diameter with my JBC Nase 2C, at 360 ° C.

    • Clean the map.

    • Inspect the card under the microscope. We can see on the picture below that a track is missing!

    • If we compare to the diagram on the PhoneBoard software;

    • We observe very clearly that we will be able to put a wire to redo this connection, focusing on R1103.

    • Take copper wire diameter 0.02mm

    • Apply flux and tin the wire with an iron.

    • Scratch the trail from C12 to R1103.

    • Etaminate this track with tin.

    • Come weld one end of the wire to the resistor. I use a 0.01mm diameter tip.

    • Weld the wire along the previously tinned track.

    • Bring the wire into the C12 slot and try to wrap it to be sure that the chip ball will stick to it.

  2. Android Fix Kits

    A new screen or battery is one kit away.

    Shop Now

    Android Fix Kits

    A new screen or battery is one kit away.

    Shop Now
    • The procedure is the same for F12, H12, J12. A12 and B12 are grounded and are not used for U3101 operation, no need to jump.

    • E12 is in contact with C1, if C1 is present no need to redo the jumper. D12, G12, J11 and A5 are connected to each other, if only one is still connected the phone can work. K12, L12, M12 are "No Connection" so no need to replace.

  3. Ask the flow. Take a soldering iron with tin at the end.
    • Ask the flow.

    • Take a soldering iron with tin at the end.

    • Pass on the chip to smooth the balls.

    • Clean.

    • Lay a stencil of reballing.

    • Spread some soldering paste.

    • Heat with hot air to form the balls.

    • Extract the chip by pushing with a thin tweezers.

    • Check the size of the balls.

    • And we end up putting the chip back. Flow, position and solder with hot air.

    • We let the phone cool, we go back and the problem is solved!

Conclusion

To reassemble your device, follow the instructions in reverse order.

Special thanks to these translators:

100%

These translators are helping us fix the world! Want to contribute?
Start translating ›

Alexandre Isaac

Member since: 04/07/2013

1,339 Reputation

7 Guides authored

Team

Phone Repair Toulouse Member of Phone Repair Toulouse

Business

1 Member

14 Guides authored

One Comment

Are there any micro soldering techs that do business through the mail. I don’t have any close to my area at all that give me wholesale prices any longer, and I am in need BAD!!!! PLEASE RESPOND ASAP! I do mostly iPhones only. Sometimes there are a few oddballs and I live in MA. I need this person to start ASAP. Thanks!

Rachel Kelley - Reply

Add Comment

View Statistics:

Past 24 Hours: 16

Past 7 Days: 117

Past 30 Days: 433

All Time: 1,382