This guide provides step-by-step instructions for replacing the headphone jack on the HTC One S. Intermediate soldering skills are required to remove the component.

  1. We recommend that you clean your microwave before proceeding, as any nasty gunk on the bottom may end up stuck to the iOpener.
    • We recommend that you clean your microwave before proceeding, as any nasty gunk on the bottom may end up stuck to the iOpener.

    • Place the iOpener in the center of the microwave.

      • For carousel microwaves: Make sure the plate spins freely. If your iOpener gets stuck, it may overheat and burn.

  2. Heat the iOpener for thirty seconds.
    • Heat the iOpener for thirty seconds.

    • Throughout the repair procedure, as the iOpener cools, reheat it in the microwave for an additional thirty seconds at a time.

    • Be careful not to overheat the iOpener during the repair. Overheating may cause the iOpener to burst.

    • Never touch the iOpener if it appears swollen.

    • If the iOpener is still too hot in the middle to touch, continue using it while waiting for it to cool down some more before reheating. A properly heated iOpener should stay warm for up to 10 minutes.

    • Remove the iOpener from the microwave, holding it by one of the two flat ends to avoid the hot center.

    • The iOpener will be very hot, so be careful when handling it. Use an oven mitt if necessary.

    • Handling it by the tag, place the heated iOpener across the bottom casing.

    • Let the iOpener sit for at least a minute to soften the adhesive beneath the casing.

    • Gently place an opening pick in the corner of the gap between the bottom casing and rear case.

    • Slide the opening pick along the side of the casing, prying it away from the adhesive as you go.

    • Use your fingers to pull the bottom casing off the rest of the phone.

    • Starting at the groove near the headphone jack, use a plastic opening tool to lift the top casing.

    • Use your fingers to pull the top casing off of the rest of the phone.

    • Remove the following screws holding the rear case to the rest of the phone:

      • Two 3.15 mm Phillips #00 screws

      • One 4.15 Torx T5 screw

      • One 4 mm Torx T5 screw

    • Place your fingers on either side of the phone and gently push up on the rear case.

    • It is important to start from the bottom of the phone because the rear case wraps around the front of the phone at the top which makes it impossible to start prying from there.

    • Pull the rear case away from the rest of the phone with your hands.

    • Using the pointed end of a spudger, lift the battery cable and release the connector.

    • Switching to the flat end of the spudger, work your way underneath the battery and peel it away from the adhesive.

    • Remove the battery from the phone.

    • Remove the three 3.15mm Phillips #00 screws from the turquoise case.

    • Using a plastic opening tool, lift the turquoise case from the end near the headphone jack.

    • Remove the turquoise cover from the phone.

    • A camera filter is now free to move, so remove it using tweezers.

    • Use tweezers to lift the yellow polyimide tape that covers the ZIF connectors.

    • Use the pointed end of a spudger to lift the white tab on the largest ZIF connector opposite the USB connector.

    • Use the pointed edge of a spudger to work the ZIF cable out of its connector.

    • To do this, you may have to slowly work both sides until the whole cable is released.

    • Repeat the procedure from steps 19 and 20 to remove the cables from the remaining ZIF connectors.

    • Using the pointed end of the spudger, pop the antenna cable from its connector on the motherboard.

    • Remove the 3.15 mm Phillips #00 screw from the motherboard.

    • Remove the motherboard from the rest of the phone.

    • Using tweezers, remove the adhesive tape around the headphone jack.

    • Using a soldering iron set at 400 degrees Celsius (752 degrees Fahrenheit), heat the solder joints lateral to the headphone jack. Use a pair of tweezers to lift the headphone jack from the board.

    • Extreme caution should be taken when working with high-temperature equipment to reduce the chance of burns.

    • It is strongly recommended that this guide on desoldering surface-mounted components is referenced before proceeding.


To reassemble your device, follow these instructions in reverse order.

Adam Redmond

Member since: 05/16/2017

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IUPUI, Team S4-G3, Harley Spring 2017 Member of IUPUI, Team S4-G3, Harley Spring 2017


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