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Amazon Fire Phone Teardown

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What sorts of chips have been forged for the Fire Phone? Let's see:

Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU is layered underneath)

Samsung KLMBG4GEAC-B001 32 GB eMMC NAND Flash

Qualcomm WCD9320 audio codec

Qualcomm QFE2320 multiband power amplifier

InvenSense MPU6500 (labeled as MP65 G266B1 L1351)

NXP 47803 NFC controller

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