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Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:

A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC

The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on getting as much tech in the tiniest package—which was already used in the original Galaxy Watch.

S915 SBN3K Intermediate Frequency IC

NXP 80T17 NFC controller

Broadcom BCM430132 WiFi/Bluetooth module and Broadcom GNSS Location Hub for GPS/GLONASS/etc

Qualcomm Atheros QPA5580

IDT P9222S wireless power receiver

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