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The Flip packs a dense, double-stacked motherboard—known in the industry as a substrate-like PCB. We first saw this space-saving technology in the iPhone X, and more recently in the Note10. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:

Samsung 925 K3UH7H7 (likely 8 GB of RAM layered on top of the Snapdragon 855 CPU)

Samsung 949 KLUEG8UHDB (likely the 256 GB of flash storage)

Broadcom AFEM-9106 front-end module

Skyworks 78160-51 low noise amplifier

Qualcomm SDR8150 RF transceiver

Qualcomm WCN3998 WiFi + Bluetooth SoC

NXP 80T17 NFC controller

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