The Flip packs a dense, double-stacked motherboard—known in the industry as a substrate-like PCB. We first saw this space-saving technology in the iPhone X, and more recently in the Note10. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:
Samsung 925 K3UH7H7 (likely 8 GB of RAM layered on top of the Snapdragon 855 CPU)
Samsung 949 KLUEG8UHDB (likely the 256 GB of flash storage)
Broadcom AFEM-9106 front-end module
Skyworks 78160-51 low noise amplifier
Qualcomm SDR8150 RF transceiver
Qualcomm WCN3998 WiFi + Bluetooth SoC
NXP 80T17 NFC controller
Your contributions are licensed under the open source Creative Commons license.
Insert a new line below
Insert a new line above
Indent current line
Unindent current line
Delete current line
Navigate to next step.
Navigate to previous step.