Skip to main content
English
Chinese

Translating step 9

Step 9
How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course. The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers. With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.
  • How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course.

  • The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers.

  • With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.

  • The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the very first iPhone (third photo).

  • The downside of this clever design is that many board-level repairs will be a lot more difficult.

苹果是靠什么技术在原有面积70%的地方上加入更多的技术呢?那就是将一块主板对折

两块单独主板焊接在了一起,所以我们从我们的伙伴Circuitwise那儿借到了BGA工作台以分离两层主板

将两层主板分离后,我们计算了单个主板的面积并累加在一起,发现iPhone X的主板总面积是iPhone 8 Plus主板的135%,这就是苹果以退为进的办法

iPhone X的主板是我们从第一代iPhone以来看到的第一个双层主板(第三张照片)

这个聪明的设计所带来的缺点是许多主板级维修将会变得更困难

Your contributions are licensed under the open source Creative Commons license.