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Translating step 9

Step 9
How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course. The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers. With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.
  • How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course.

  • The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers.

  • With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.

  • The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the very first iPhone (third photo).

  • The downside of this clever design is that many board-level repairs will be a lot more difficult.

¿Cómo es que Apple pudo poner más tecnología en 70% de su huella? Doblando la placa por la mitad por supuesto.

Las dos mitades están soldadas juntas, entonces recibimos ayuda de Circuitwise y su estación de refundir de aire caliente BGA para separar las placas.

Con las piezas separadas, contamos el área de todas las capas separadas y la sumamos hasta el 135% del área de la placa lógica del iPhone 8 Plus. Forma de ir poniendo más en menos, Apple.

La placa lógica del iPhone X es la primera doble placa amontonada que hemos visto en un iPhone desde el primer iPhone (tercera foto).

Lo malo de este diseño inteligente es que las reparaciones de placa serán sumamente difícil —casi imposible en algunas ocaciones.

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