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Translating step 10

Step 10
On the first half: Apple APL1W72 A11 Bionic SoC layered over SK Hynix H9HKNNNDBMAUUR 3 GB LPDDR4x RAM
  • On the first half:

  • Apple APL1W72 A11 Bionic SoC layered over SK Hynix H9HKNNNDBMAUUR 3 GB LPDDR4x RAM

  • Apple 338S00341-B1 power management IC

  • Texas Instruments SN2501 battery charger

  • NXP Semiconductor CBTL1612A1—Likely an iteration of the 1610 tristar IC

  • Apple 338S00248 audio codec

  • STMicroelectronics STB600B0 power management

  • Apple 338S00306 power management IC

第一层主板:

苹果(Apple) APL1W72 A11仿生处理器,封装 海力士(SK Hynix )H9HKNNNDBMAUUR 3 GB LPDDR4X 内存

苹果(Apple) 338S00341-B1 电源管理IC

德州仪器(Texas Instruments) 78AVZ81 充电管理IC

恩智浦半导体(NXP Semiconductor) 1612A1—可能是1610 Tristar IC的迭代产品

苹果(Apple) 338S00248 音频解码器

意法半导体(STMicroelectronics) STB600B0 电源管理芯片

苹果(Apple) 338S00306 电源管理IC

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