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Translating step 18

Step 18
Two more ICs on the front of the logic board: 57A6CVI
  • Two more ICs on the front of the logic board:

  • 57A6CVI

  • Qualcomm QFE1100 Envelope Tracking IC

  • Based on alleged schematics leaked last month, the rumor mill had the A9 pegged at a 15% smaller die size from the A8. We can't confirm the die size, but the A9 package itself appears bigger—roughly 14.5 x 15 mm, up from 13.5 x 14.5 mm on the A8. That could represent a smaller die plus the addition of the embedded M9 and other functions.

在逻辑电路板前的另外2个芯片:

57A6CVI

高通QFE1100包络跟踪芯片

基于上个月被泄露的所谓示意图,谣言称A9有比A8小15%的芯片尺寸。我们无法确认芯片尺寸,但A9包装本身就较大——约14.5×15毫米,而A8为13.5 x 14.5毫米。这可能代表着是一个更小的芯片加上嵌入式M9和其他功能。

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