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Fix Your Stuff

Right to Repair

Parts & Tools

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Translating step 17

Step 17
And now, for the moment we've all been waiting for... It's time to reveal some ICs on the front of the logic board: Apple A9 APL0898 SoC + Samsung 2 GB LPDDR4 RAM (as denoted by the markings K3RG1G10BM-BGCH)
  • And now, for the moment we've all been waiting for... It's time to reveal some ICs on the front of the logic board:

  • Apple A9 APL0898 SoC + Samsung 2 GB LPDDR4 RAM (as denoted by the markings K3RG1G10BM-BGCH)

  • Qualcomm MDM9635M LTE Cat. 6 Modem (vs. the MDM9625M found in the iPhone 6)

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo (also found in iPhone 6)

  • Bosch Sensortec 3P7 LA 3-axis Accelerometer (likely BMA280)

  • TriQuint TQF6405 Power Amplifier Module

  • Skyworks SKY77812 Power Amplifier Module

  • Avago AFEM-8030 Power Amplifier Module

さていよいよ待ちに待った瞬間がやってきました…基板の正面に搭載されたチップを暴く時間です。

Apple の A9 プロセッサ APL0898 SoC + Samsung 2GB LPDDR4 RAM (K3RG1G10B-BGCH という記載もあり)

Qualcomm の LTE Cat.6 モデム (MDM9635M) (これに対し iPhone6 では MDM9625M が搭載)

InvenSense MP67B 6 軸ジャイロスコープと加速度センサーのコンボ(iPhone6 にも搭載)

Bosch Sensortec 3P7 3軸加速センサー (BMA280 と類似)

TriQuint TQF6405 パワーアンプモジュール

Skyworks SKY77812 のパワーアンプモジュール

Avago AFEM-8030 のパワーアンプモジュール

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