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Translating step 12

Step 12
There are two stacked circuit boards on the iPhone. The communcations board is on the top, and the logic board is located on the bottom.
  • There are two stacked circuit boards on the iPhone. The communcations board is on the top, and the logic board is located on the bottom.

  • To separate the boards, insert a spudger into the gap in the metal shielding as shown. Carefully pry with the spudger to loosen the connector.

Dans l'iPhone il y a deux circuits imprimés placés l'un sur l'autre. La carte de communication est en haut et la carte mère se situe en bas.

Pour séparer les deux, insérez une spatule dans l'interstice dans la plaque de protection métallique comme sur l'image. Bougez délicatement la spatule pour desserrer le connecteur.

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