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Translating step 11

Step 11
Let's touch some of these chips, shall we? This logic board is packing: Apple A8 APL1011 SoC + SK Hynix RAM H9CKNNN8KTMRWR-NTH 1 GB LPDDR3 RAM (Same as iPhone 6, but underclocked to 1.10 GHz per core)
  • Let's touch some of these chips, shall we? This logic board is packing:

  • Apple A8 APL1011 SoC + SK Hynix RAM H9CKNNN8KTMRWR-NTH 1 GB LPDDR3 RAM (Same as iPhone 6, but underclocked to 1.10 GHz per core)

  • NXP Semiconductors LPC18B1UK ARM Cortex-M3 Microcontroller (better known as the M8 Motion Coprocessor)

  • Toshiba THGBX3G7D2KLA0C 128 Gb (16 GB) NAND Flash

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer

  • Universal Scientific Industrial 339S0231 Bluetooth/Wi-Fi Module (Probably based on Broadcom BCM4354)

  • Broadcom BCM5976 Touchscreen Controller

  • Texas Instruments 343S0645 Touchscreen Controller

Vamos a tocar algunas de estos chips, ¿dale? Esta placa lógica tiene:

Apple A8 APL1011 SoC + SK Hynix RAM H9CKNNN8KTMRWR-NTH 1 GB de LPDDR3 RAM (Igual que el iPhone 6, pero no bloqueado a 1,10 GHz por núcleo)

NXP Semiconductors LPC18B1UK ARM Microcontrolador Cortex-M3 (mejor conocido como el coprocesador de movimiento M8)

Toshiba THGBX3G7D2KLA0C 128 Gb (16 GB) NAND Flash

InvenSense MP67B giroscopio y acelerómetro de 6 ejes

Universal Scientific Industrial 339S0231 Módulo Bluetooth / Wi-Fi (probablemente basado en Broadcom BCM4354)

Controlador de pantalla táctil Broadcom BCM5976

Texas Instruments 343S0645 controlador de pantalla táctil

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