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Translating step 7

Step 7
We pull out the G4's motherboard and get a better view of its silicon. Check out these ICs: Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.
  • We pull out the G4's motherboard and get a better view of its silicon. Check out these ICs:

  • Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM

  • The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.

  • Toshiba THGBMFG8C4LBAIR 32 GB NAND Flash

  • Broadcom BCM4339HKUBG 5G WiFi Client

  • Qualcomm PMI8994 Power Management IC

  • IDT P9025A Qi Wireless Power Receiver IC

  • Qualcomm WTR3925 LTE Transceiver

Estraiamo la scheda madre del G4 per avere una vista migliore del suo silicio. Troviamo questi circuiti integrati:

Memoria RAM da 3 GB LPDDR3 Samsung K3QF6F60AM-QGCF

Il processore esa-core da 1.8 GHz SOC Qualcomm Snapdragon 808 è sotto la RAM.

Memoria Flash NAND da 32 GB Toshiba THGBMFG8C4LBAIR

Client 5G Wi-Fi Broadcom BCM4339HKUBG

Chip Gestione Alimentazione Qualcomm PMI8994

Chip Carica Qi Wireless IDT P9025A

Ricetrasmettitore LTE Qualcomm WTR3925

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