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Translating step 7

Step 7
We pull out the G4's motherboard and get a better view of its silicon. Check out these ICs: Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.
  • We pull out the G4's motherboard and get a better view of its silicon. Check out these ICs:

  • Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM

  • The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.

  • Toshiba THGBMFG8C4LBAIR 32 GB NAND Flash

  • Broadcom BCM4339HKUBG 5G WiFi Client

  • Qualcomm PMI8994 Power Management IC

  • IDT P9025A Qi Wireless Power Receiver IC

  • Qualcomm WTR3925 LTE Transceiver

Nous retirons la carte mère du G4, ce qui nous permet de mieux voir tout ce qui s'y trouve. Voici quelques CI :

Samsung K3QF6F60AM-QGCF 3 Go LPDDR3 RAM

La puce hexacœur Qualcomm Snapdragon 808 SOC de 1.8 GHz se trouve sous la RAM.

Flash Toshiba THGBMFG8C4LBAIR 32 Go NAND

Broadcom BCM4339HKUBG 5G WiFi Client

CI de gestion de puissance Qualcomm PMI8994

CI de réception de puissance sans fil Qi IDT P9025A

Émetteur-récepteur Qualcomm WTR3925 LTE

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