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Translating step 11

Step 11
Chips up front:
  • Chips up front:

  • SK Hynix H9TU32A4GDMC 512 MB DRAM—the Qualcomm APQ8026 System on Chip is layered beneath

  • Qualcomm PM8226 power management IC

  • InvenSense MPU-6515 6-axis accelerometer + gyroscope

  • InvenSense INMP441 Microphone

  • 2407 DSH 12EDF

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