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Translating step 15

Step 15
Apple soldered the EMI shield onto the communications board, making it challenging for us to show you the chips. Despite this adversity, we pressed forward undaunted, fearlessly unsoldering the board to reveal to you: Infineon 337S3754  PMB 8878 X-Gold baseband IC 5Y06115. This part had the Infineon logo in the pre-production unit, but Apple has white-labeled it to obscure the manufacturer. This is the exact same baseband processor as the iPhone 3GS.
  • Apple soldered the EMI shield onto the communications board, making it challenging for us to show you the chips. Despite this adversity, we pressed forward undaunted, fearlessly unsoldering the board to reveal to you:

  • Infineon 337S3754 PMB 8878 X-Gold baseband IC 5Y06115. This part had the Infineon logo in the pre-production unit, but Apple has white-labeled it to obscure the manufacturer. This is the exact same baseband processor as the iPhone 3GS.

  • Skyworks SKY77340 Power Amplifier Module

  • Three Triquint power amplifier / filters.

  • Infineon U6952

  • Numonyx 36MY1EE

  • Along the right are three TriQuint power amplifiers: TQM616035A, TQM666032B, and TQM676031A. These are the same three chips that Apple used in the iPhone 3G nearly 2 years ago.

  • Broadcom A-GPS BCM47501UBG F01003 P11 949871 SN

苹果公司将电磁干扰屏蔽系统焊接到通讯板上,这使得我们向你展示芯片的过程充满了挑战性。尽管有这样的逆境,我们还是勇往直前,毫不畏惧地向你们展示:

英飞凌337S3754 PMB 8878 x -金基带IC 5Y06115。这部分在预制单元中有英飞凌的标志,但是苹果公司用白色标记来掩盖制造商。这是和iPhone 3GS完全相同的基带处理器。

Skyworks SKY77340功放模块。

三元功率放大器/滤波器。

英飞凌U6952

Numonyx 36MY1EE

右边是三个TriQuint功率放大器:TQM616035A、TQM666032B和TQM676031A。这些都是苹果在近两年前使用在iPhone3G上的芯片。

博通 A-GPS BCM47501UBG F01003 P11 949871 SN

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