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Translating step 12

Step 12
A little heat (a lot of heat) and a little prying yields two boards for the price of one! We split one of the iPhone 12 boards open to get a look at all that sweet silicon, and if it seems hard to guess which one, you're not alone—the logic boards of the 12 and 12 Pro are nearly identical, apart from a few serial numbers. Apple APL1W01 A14 Bionic SoC, layered under Micron D9XMR MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM (6 GB RAM on the 12 Pro)
  • A little heat (a lot of heat) and a little prying yields two boards for the price of one! We split one of the iPhone 12 boards open to get a look at all that sweet silicon, and if it seems hard to guess which one, you're not alone—the logic boards of the 12 and 12 Pro are nearly identical, apart from a few serial numbers.

  • Apple APL1W01 A14 Bionic SoC, layered under Micron D9XMR MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM (6 GB RAM on the 12 Pro)

  • KICM224AY4402TWNA12029, 64 GB of Kioxia NAND flash memory.

  • Qualcomm SDR865 5G and LTE transceiver

  • Qualcomm SDX55M 5G modem-RF system and SMR526 intermediate frequency IC

  • USI/Apple U1 ultra-wideband chip

  • Avago AFEM-8200 high/mid power amplifier with integrated duplexer

  • Apple APL1094 343S00437 power management IC

少しの熱と(実際はかなりの熱が必要)、少しのこじ開け作業で、2つのボードを同時に取り出せます。iPhone 12のボードの片側を開き、搭載された素晴らしいチップを調べていきます。 12のボードはどちら側か混乱してしまう方へ、あなただけではありません。12と12 Proのロジックボードは幾つかのシリアル番号の違いを除いて、非常によく似ています。

Micron D9XMR MT53D512M64D4UA-046 XT:F 4GB (12 Proは6GB) LPDDR4 SDRAMの下に積層された Apple APL1W01 A14 Bionic SoC

KICM224AY4402TWNA12029、64 GB of Kioxia NAND フラッシュメモリ

Qualcomm SDR865 5GとLTEトランシーバー

Qualcomm SDX55M 5G modem-RF systemとSMR526 中間周波数IC

USI/Apple U1 超広帯域無線チップ

Avago AFEM-8200 デュプレクサ内蔵 ハイ/ミッドパワーアンプ

Apple APL109 4343S00437 パワーマネージメントIC

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