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Translating step 15

Step 15
More chips on the underside of the logic board: Qualcomm PM8018 RF power management IC
  • More chips on the underside of the logic board:

  • Qualcomm PM8018 RF power management IC

  • Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash

  • Apple 338S1131 dialog power management IC*

  • Apple 338S1117 Cirrus Logic Class D Amplifiers. The die inside is a Cirrus Logic device (second image) but it does not look like the audio codec.

  • STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones

  • Murata 339S0171 (based on Broadcom BCM4334) Wi-Fi module

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