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Translating step 11

Step 11
The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board. Chipwise, we spy: Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)
  • The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.

  • Chipwise, we spy:

  • Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)

  • Toshiba THGBX4G7D2LLDYC 16 GB NAND flash

  • USI 339S00450 WiFi/Bluetooth module, likely with a Broadcom BCM43572 trapped inside

  • Apple/Dialog Semiconductor 338S00100-AZ PMIC

  • Interestingly, the reverse has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

下一张出来的部件包含那些精致的抽绳系具-在此之后,是它的主板。

芯片明智的, 我们完整地看到:

苹果A8 APL1011 SoC(我们之前已经看到过这个,但是做了一个不同的工作),似乎与下面的1 GB RAM配合

东芝THGBX4G7D2LLDYC 16 GB NAND闪存

USI 339S00450(WiFi /蓝牙模块?)

338S00100-AZ

有趣的是,反面还有一些未填充的SMD焊盘,只有少量芯片和几个无源器件。 也许在最后时刻HomePod进行了一些设计变更?

[* black] The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.
[* black] Chipwise, we spy:
[* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM layered underneath(layered on top in typical PoP configuration)
[* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM layered underneath(layered on top in typical PoP configuration)
[* orange] Toshiba THGBX4G7D2LLDYC 16 GB NAND flash
[* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true]
[* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* black] Interestingly, [https://d3nevzfk7ii3be.cloudfront.net/igi/UYNZVyo2AiAL1djs|the reverse|new_window=true] has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

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