Skip to main content

Fix Your Stuff

Right to Repair

Store

English
Japanese

Translating step 11

Step 11
The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board. Chipwise, we spy: Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)
  • The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.

  • Chipwise, we spy:

  • Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)

  • Toshiba THGBX4G7D2LLDYC 16 GB NAND flash

  • USI 339S00450 WiFi/Bluetooth module, likely with a Broadcom BCM43572 trapped inside

  • Apple/Dialog Semiconductor 338S00100-AZ PMIC

  • Interestingly, the reverse has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

この取り出したディスクには精巧な引き紐状のモーリング(錨のような留め金)が付いており、反対側にはメインの基板があります。

確認したチップです。

下に積層された1 GB RAMとペアとなっている模様のApple A8 APL1011 SoC (以前、目にしたことがあるチップですが、役割は違います。) 一般的なPoP構成では上に積層されています。

Toshiba THGBX4G7D2LLDYC 16 GB NANDフラッシュ

USI 339S00450 WiFi/Bluetoothモジュール。Broadcom BCM43572が内側に搭載

Apple/Dialog 338S00100-AZPMIC

面白いことに、裏側には数個のチップとパッシブセンサー用に作られたと思われる空のSMDパッドが付いています。HomePod は最後の最後でデザインチェンジをしたのでしょうか?

[* black] The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.
[* black] Chipwise, we spy:
[* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)
[* orange] Toshiba THGBX4G7D2LLDYC 16 GB NAND flash
[* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true]
[* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* black] Interestingly, [https://d3nevzfk7ii3be.cloudfront.net/igi/UYNZVyo2AiAL1djs|the reverse|new_window=true] has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

Your contributions are licensed under the open source Creative Commons license.