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Introduction

Rosin and the freeze spray are the two commonly used and low-cost methods for faulty components locating when repairing logic boards. Still, you can use the Thermal Imager instead for more efficient repair work if the two methods become time-consuming. Check our iPhone X repair guide today and you will be surprised at how the Thermal Imager is used in iPhone X won’t turn on repair. Also, for repair technicians, it’s important for you to understand how iPhone X boot circuit works before starting your repair work.

Video Overview

  1. Hold the power button to turn on the phone. The phone won’t turn on.
    • Hold the power button to turn on the phone. The phone won’t turn on.

    • Take apart the phone and disconnect the battery. Remove the screen and take out the motherboard.

    • Let’s check the boot current first. The boot current is larger than normal value.

    • Touch the motherboard with one hand. The NAND flash chip and the area surrounding it are hot.

  2. Since there are so many components on the hot area, we can locate the faulty component with the help of the Thermal Imager.
    • Since there are so many components on the hot area, we can locate the faulty component with the help of the Thermal Imager.

    • Put the motherboard under the Thermal Imager. Get the motherboard powered on. We can see clearly that C2647 is extremely hot. Judging by this, C2647 is probably damaged.

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  4. Let’s remove C2647 and run diode mode measurement of its bonding pad. The measured value is normal.
    • Let’s remove C2647 and run diode mode measurement of its bonding pad. The measured value is normal.

    • We can confirm now that C2647 is damaged.

  5. Let’s replace with a new capacitor and see how it works.
    • Let’s replace with a new capacitor and see how it works.

    • Clean the bonding pad and solder new capacitor. Assemble the phone and test. The phone turns on normally.

Finish Line

2 other people completed this guide.

Phryne

Member since: 11/17/2019

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