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Introduction

iPhone water damage has always been a frustrating and difficult issue for repair technicians. Things can also be much more difficult when it comes with iPhone X/XS/XS Max. What you usually do with iPhone water damage repair? Got your unique repair thoughts? Well, don’t panic! This iPhone X water damage repair guide shall definitely enlighten you.

Video Overview

  1. Press the power button to turn on the phone. There is no response at all.
    • Press the power button to turn on the phone. There is no response at all.

    • Let’s take apart the phone and remove the display assembly first.

    • Connect the battery connector with the DC Power Supply. Current reading on the ammeter jumps to 100mA and then stays still, which is abnormal.

  2. The first thing we do is to separate the upper layer from the lower layer with the help of the specialized Heating Platform.
    • The first thing we do is to separate the upper layer from the lower layer with the help of the specialized Heating Platform.

  3. Check the two layers under the Microscope. Nothing goes wrong with the upper layer.
    • Check the two layers under the Microscope. Nothing goes wrong with the upper layer.

    • Yet areas on the lower layer bear obvious signs of water damage.

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  5. Attach the upper layer and the lower layer to the test fixture and get the phone powered on with tweezers.
    • Attach the upper layer and the lower layer to the test fixture and get the phone powered on with tweezers.

    • Current reading on the ammeter jumps to 100mA and then stays still, which is abnormal. Disconnect the power supply.

    • Connect the battery connector on the upper layer with the DC Power Supply. Get the phone powered on with tweezers. Current reading on the ammeter is normal this time.

    • Judeging by this, the fault is probably related to the lower layer.

  6. Run diode mode measurement of capacitors around the moldy IC U3400, Nothing goes wrong.
    • Run diode mode measurement of capacitors around the moldy IC U3400, Nothing goes wrong.

    • Continue to run diode mode measurement of the third space PCB. The measured value of Pin S30 is 40, which is abnormal.

    • Since Pin S30 is connected directly to Pin L4 of U3400, the fault is probably related to U3400. So the next thing we do is to check U3400.

    • Remove U3400 with Hot Air Gun. We can see that U3400 and its bonding pad have mildewed severely.

  7. Replace U3400 with a new IC.
    • Replace U3400 with a new IC.

    • Again, run diode mode measurement of Pin S30 on the third space PCB. The measured value is normal this time.

    • Attach the upper layer and the lower layer to the test fixture. Current reading on the ammeter is normal this time and the phone turns on normally.

  8. In this step we will use a very useful tool, known as iPhone X specialized reballing mold. It can help us complete the reballing process perfectly.
    • In this step we will use a very useful tool, known as iPhone X specialized reballing mold. It can help us complete the reballing process perfectly.

    • With the help of iPhone X specialized Heating Platform, the motherboard recombining process is very easy and efficient.

  9. Now we can assemble the phone and test.
    • Now we can assemble the phone and test.

    • Press the power button to turn on the phone. The phone turns on normally.

Finish Line

2 other people completed this guide.

Phryne

Member since: 11/17/2019

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53 Guides authored

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