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Introduction

CPU swap for data recovery is rarely required for iPhone X data recovery. Most iPhone X logic boards that don’t boot can either be solved by an experienced board level repair technician, or are due to software corruption in which case CPU swap can’t help you. However, for some boards with catastrophic hardware damage (like the phone went through a lawnmower) it can be a useful technique. Find a reputable company with experience in iPhone X data recovery before considering an invasive surgery such as described here.

Video Overview

  1. The boot current is abnormal. So the PCB board might have been damaged.  We can troubleshoot this logic board to solve the problem, or take a risk and transfer the CPU and other unique chips to a receiver board.
    • The boot current is abnormal. So the PCB board might have been damaged. We can troubleshoot this logic board to solve the problem, or take a risk and transfer the CPU and other unique chips to a receiver board.

    • To recover data, we decide in this case to transplant CPU and some other chips to a receiver board.

  2. Attach the upper layer to the PCB Holder. Heat and pry up the NAND flash chip with a specialized knife. Next, let’s detach CPU, EEPROM, Baseband CPU and Baseband EEPROM from the board with the same steps.  Please know that not all of these chips are required to be transferred for data recovery.
    • Attach the upper layer to the PCB Holder. Heat and pry up the NAND flash chip with a specialized knife.

    • Next, let’s detach CPU, EEPROM, Baseband CPU and Baseband EEPROM from the board with the same steps. Please know that not all of these chips are required to be transferred for data recovery.

  3. Now, we need to reball these detached components. Let's start with the NAND flash chip.
    • Now, we need to reball these detached components. Let's start with the NAND flash chip.

    • Clean the NAND flash chip first and then reball the chip. Once done, continue to reball the baseband CPU, CPU, EEPROM and baseband EEPROM with the same steps.

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  5. Please be noted that the WiFi module is bound up with WiFi address stored in the NAND flash chip. So our next move is to unbind WiFi. Connect the PCIE NAND Flash Chip Programmer with computer and have the WiFi unbound.
    • Please be noted that the WiFi module is bound up with WiFi address stored in the NAND flash chip. So our next move is to unbind WiFi.

    • Connect the PCIE NAND Flash Chip Programmer with computer and have the WiFi unbound.

  6. Now, we need to solder these detached components of the original motherboard to the new motherboard.
    • Now, we need to solder these detached components of the original motherboard to the new motherboard.

    • Apply some BGA Paste Flux to the bonding pad of the NAND flash chip and solder the chip with hot air gun.

    • Continue to solder CPU, EEPROM, baseband CPU and the baseband EEPROM with the same steps.

  7. Next thing we do is to solder the two layers back together. Before soldering, attach the upper layer and the lower layer to the test fixture.
    • Next thing we do is to solder the two layers back together. Before soldering, attach the upper layer and the lower layer to the test fixture.

    • Connect the upper layer and the lower layer with the display assembly and get the board powered on. The phone can get access to the home screen normally.

  8. Reball the lower layer first. Then apply some BGA Paste Flux to the third space pcb. Attach the reball finished lower layer to the heating platform and then solder the upper layer.
    • Reball the lower layer first. Then apply some BGA Paste Flux to the third space pcb.

    • Attach the reball finished lower layer to the heating platform and then solder the upper layer.

  9. Now we can assemble the phone and test.
    • Now we can assemble the phone and test.

    • Get the logic board and display assembly installed, connect the battery and press power button, the phone turns on normally. iPhone X data recovery completed successfully.

One other person completed this guide.

Phryne

Member since: 11/17/2019

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