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[* black] Some more shots of that saucy camera, including a Chipworks x-ray!
[* black] Chipworks [http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns/2012/06/inside-the-samsung-galaxy-siii/|report[http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns/2012/06/inside-the-samsung-galaxy-siii/|Chipworks reports] that the camera has a Sony BSI sensor. Contrary to earlier reportsrumours, their initial inspection suggests it is a new sensor, and not the same one used in the [guide|6610|iPhone 4S]. The bond pad arrangement is not the same as the IMX145 found in the iPhone 4S nor is it the same as the IMX105 found in previous Samsung phones.
[* black] Chipworks [http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns/2012/06/inside-the-samsung-galaxy-siii/|report[http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns/2012/06/inside-the-samsung-galaxy-siii/|Chipworks reports] that the camera has a Sony BSI sensor. Contrary to earlier reportsrumours, their initial inspection suggests it is a new sensor, and not the same one used in the [guide|6610|iPhone 4S]. The bond pad arrangement is not the same as the IMX145 found in the iPhone 4S nor is it the same as the IMX105 found in previous Samsung phones.