Use tweezers to grasp the circular silver metal piece firmly and pull it away from the top panel with enough force to break the glue bond.
Insert an opening tool underneath the top panel near the top left side of the back of the phone.
Gently lift the panel from the back of the phone.
Your contributions are licensed under the open source Creative Commons license.
Insert a new line below
Insert a new line above
Indent current line
Unindent current line
Delete current line
Navigate to next step.
Navigate to previous step.