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Editing Step 5 —

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Place the brand new 256GB NAND on the repair platform. Get the BGA Reballing Stencil in position. Smear medium-temp solder paste evenly on the stencil.

Heat with Hot Air Gun so that all solder balls can shape up completely. Once completed, wait for 1 minute.

Then separate the NAND flash chip from the stencil. Heat again to ensure the formation of solder balls.

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