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Changes to Step #14

Edit by Kyle Wiens

Edit approved by Kyle Wiens

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[* black] Check outHow did Apple stack the depth oftwo boards? They created a third spacer PCB that lines the logic board enclosureperimeter. Instead of a fussy flex cable, data travels along dozens of through-hole vias.
[* black] 3D X-Ray shotsHere, the A11 SoC lies nestled at the center of the logicmain board. You can get a sense of the 3D structure of the board from the X-ray photos. The cylinders around the edge are holes filled with solder connecting the two boards.
[* black] Check outHow did Apple stack the depth oftwo boards? They created a third spacer PCB that lines the logic board enclosureperimeter. Instead of a fussy flex cable, data travels along dozens of through-hole vias.
[* black] 3D X-Ray shotsHere, the A11 SoC lies nestled at the center of the logicmain board. You can get a sense of the 3D structure of the board from the X-ray photos. The cylinders around the edge are holes filled with solder connecting the two boards.

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