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Changes to Step #7

Edit by Miroslav Djuric

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[* blackicon_note] Next we will cover a moderately difficult soldering application. In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.
[* icon_note] Small electronic components, including wires, cannot dissipate heat as quickly as larger components. ThisThis makes them very susceptible to overheating. As stated before,Make sure to heat the connection just long enough to melt the solder.
[* black] We haveThe leads were removed the leads from the solder pads by heating the joint fromon the top side of the boardboard, while pulling out the lead away from the boardleads with a pair of tweezers.
[* blackicon_note] Next we will cover a moderately difficult soldering application. In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.
[* icon_note] Small electronic components, including wires, cannot dissipate heat as quickly as larger components. ThisThis makes them very susceptible to overheating. As stated before,Make sure to heat the connection just long enough to melt the solder.
[* black] We haveThe leads were removed the leads from the solder pads by heating the joint fromon the top side of the boardboard, while pulling out the lead away from the boardleads with a pair of tweezers.