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Changes to Step #7

Edit by Andrew Bookholt

Pending approval


Step Lines

[* black] Next we will cover a moderately difficult soldering application. In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.
[* icon_note] Small electronic components, including wires, cannot dissipate heat as quickly as larger components. This makes them very susceptible to overheating. As stated before, heat the connection just long enough to melt the solder.
[* black] We have removed the leads from the solder pads by heating the joint from the top side of the board while pulling the lead away from the board with a pair of tweezers.

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