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Changes to Step #3

Edit by Miroslav Djuric

Pending approval

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[* black] When the tool has completely passed through the hole after pressing from the opposite side of the boardhole, enlarge the hole by heating the top side of the solder pad while pressing through with the tool.
[* black] When the tool has completely passed through the hole after pressing from the opposite side of the boardhole, enlarge the hole by heating the top side of the solder pad while pressing through with the tool.
[* icon_note] Both solder holes should now be open enough to insert the bare leads of your component.