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Changes to Step #3

Edit by Maxwell Erickson

Edit approved by Maxwell Erickson

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[* red] Use the Micro soldering iron to heat up each pad and use the desoldering wick to wick up the melted solder.
[* black] The surface mount jack should pull from the surface without much force. Use tweezers to apply upward pressure on on the jack.
[* icon_caution] Do not apply too much heat to the board as it may damage other portions of the board.

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