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Changes to Step #18

Edit by Geoff Wacker

Edit approved by Geoff Wacker

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[* black] OneTwo more ICICs on the front of the logic board:
[* black] OneTwo more ICICs on the front of the logic board:
[* red] 57A6CVI
[* orange] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-QFE1100&viewState=DetailView&cartID=&g=|QFE1100|new_window=true] Envelope Tracking IC
[* icon_note] Based on alleged schematics leaked last month, the rumor mill had the A9 pegged at a 15% smaller die size from the A8. We can't confirm the die size, but the A9 package itself appears bigger—roughly 14.5 x 15 mm, up from 13.5 x 14.5 mm on the A8. That could represent a smaller die plus the addition of the embedded M9 and other functions.

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