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Fix Your Stuff

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Changes to Step #7

Edit by Miroslav Djuric

Pending approval

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[* black] Shown here is a picture of the SiTime SI8002AC package with its outer protective casing removed.
[* black] An ASIC to convert the raw signals of the oscillator is stacked on top of the oscillator itself, and the two are wire-bonded together for signal transfer. This entire unit is completely sealed inside the plastic outer package.
[* black] The second picture is an X-Ray of a Bosch BMA 220 showing its stackedstacked die configuration and theof a Bosch BMA 220. The wire bonds connecting thoseconnect the dies both together and to the ball grid array.
[* black] Stacking dies allows chip manufacturers to pack more functionality on the same basic footprint. This is especially important in mobile devices such as the iPhone 44, where board space is at a minimumminimal.
[* black] The second picture is an X-Ray of a Bosch BMA 220 showing its stackedstacked die configuration and theof a Bosch BMA 220. The wire bonds connecting thoseconnect the dies both together and to the ball grid array.
[* black] Stacking dies allows chip manufacturers to pack more functionality on the same basic footprint. This is especially important in mobile devices such as the iPhone 44, where board space is at a minimumminimal.