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Changes to Step #10

Edit by Jeff Suovanen —

Edit approved by Jeff Suovanen

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[* black] What sortsorts of chips have been forged for the Fire Phone? Let's see:
[* black] What sortsorts of chips have been forged for the Fire Phone? Let's see:
[* red] Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU are layered underneath)
[* orange] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-KLMBG4GEAC-B001&viewState=DetailView&cartID=&g=|KLMBG4GEAC-B001|new_window=true] 32 GB eMMC NAND Flash
[* yellow] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-WCD9320&viewState=DetailView&cartID=&g=|WCD9320|new_window=true] audio codec
[* green] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-QFE2320&viewState=DetailView|QFE2320|new_window=true] multiband power amplifier
[* blue] InvenSense [link|http://www.invensense.com/mems/gyro/mpu6500.html|MPU6500|new_window=true] (labeled as MP65 G266B1 L1351)
[* violet] NXP [link|https://chipworks.secure.force.com/catalog/ProductDetails?sku=NXP-47803&viewState=DetailView&cartID=&g=|47803|new_window=true] NFC controller