Changes to Step #10
Edit by Jeff Suovanen —
Edit approved by Jeff Suovanen
- Before
- After
- Unchanged
Step Lines
| - | [* black] What |
|---|---|
| + | [* black] What sorts of chips have been forged for the Fire Phone? Let's see: |
| [* red] Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU are layered underneath) | |
| [* orange] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-KLMBG4GEAC-B001&viewState=DetailView&cartID=&g=|KLMBG4GEAC-B001|new_window=true] 32 GB eMMC NAND Flash | |
| [* yellow] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-WCD9320&viewState=DetailView&cartID=&g=|WCD9320|new_window=true] audio codec | |
| [* green] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-QFE2320&viewState=DetailView|QFE2320|new_window=true] multiband power amplifier | |
| [* blue] InvenSense [link|http://www.invensense.com/mems/gyro/mpu6500.html|MPU6500|new_window=true] (labeled as MP65 G266B1 L1351) | |
| [* violet] NXP [link|https://chipworks.secure.force.com/catalog/ProductDetails?sku=NXP-47803&viewState=DetailView&cartID=&g=|47803|new_window=true] NFC controller |