Changes to Step #10
Edit by Walter Galan —
Edit approved by Walter Galan
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Step Lines
| [* black] What sort of chips have been forged for the Fire Phone? Let's see: | |
| [* red] Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU are layered underneath) | |
| [* orange] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-KLMBG4GEAC-B001&viewState=DetailView&cartID=&g=|KLMBG4GEAC-B001|new_window=true] 32 GB eMMC NAND Flash | |
| [* yellow] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-WCD9320&viewState=DetailView&cartID=&g=|WCD9320|new_window=true] audio codec | |
| [* green] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-QFE2320&viewState=DetailView|QFE2320|new_window=true] multiband power amplifier | |
| - | [* blue] InvenSense MPU6500 (labeled as MP65 G266B1 L1351) |
| + | [* blue] InvenSense [link|http://www.invensense.com/mems/gyro/mpu6500.html|MPU6500|new_window=true] (labeled as MP65 G266B1 L1351) |
| [* violet] NXP [link|https://chipworks.secure.force.com/catalog/ProductDetails?sku=NXP-47803&viewState=DetailView&cartID=&g=|47803|new_window=true] NFC controller |