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Fix Your Stuff

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Parts & Tools

Changes to Step #10

Edit by Walter Galan

Edit approved by Walter Galan


Step Lines

[* black] What sort of chips have been forged for the Fire Phone? Let's see:
[* red] Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU are layered underneath)
[* orange] Samsung [|KLMBG4GEAC-B001|new_window=true] 32 GB eMMC NAND Flash
[* yellow] Qualcomm [|WCD9320|new_window=true] audio codec
[* green] Qualcomm [|QFE2320|new_window=true] multiband power amplifier
[* blue] MP65 G266B1 L1351
[* blue] MP65 G266B1 L1351
[* violet] NXP [link||47803|new_window=true] NFC controller