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Changes to Step #11

Edit by Miroslav Djuric

Edit approved by Miroslav Djuric

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[* black] With a bit of patient spudgering, the boards are disengaged—leaving the motherboard stripped and primed for some primo IC analysis:
[* red] Maxim Integrated [link|http://pdf.datasheetarchive.com/indexerfiles/gl/Datasheets-UEA1/DSAFRAZ007630.pdf|MAX77836|new_window=true] Low-Voltage Input, 3V/3.3V/5V/ Adjustable Output, Step-Up DC-DC Converter
[* orange] 1513E8 E614A6Broadcom [http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4334|BCM4334W] Bluetooth 4.0 / 802.11 a/b/g/n Wi-Fi / FM Receiver
[* orange] 1513E8 E614A6Broadcom [http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4334|BCM4334W] Bluetooth 4.0 / 802.11 a/b/g/n Wi-Fi / FM Receiver
[* yellow] STMicroelectronics [http://www.st.com/web/en/resource/technical/document/datasheet/DM00086815.pdf|STM32F401B|new_window=true] ARM-Cortex M4 MCU with 128KB Flash
[* green] Samsung KMF5X0005A-A210 512 MB DRAM package with the Qualcomm APQ8026 System on Chip layered beneath
[* blue] Qualcomm PM8226 power management IC
[* violet] InvenSense [http://www.invensense.com/mems/gyro/nineaxis.html|MP92M|new_window=true] 9-axis Gyro + Accelerometer + Compass
[* black] InvenSense ICS-43430 microphone