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Changes to Step #15

Edit by Nat Welch

Pending approval

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[* black] A shot of the logic board minus the steel EMI shield.
[* black] The manufacturer of the memory has switched from Toshiba on the FCC teardown to Samsung on this device.
[* black] Broadcom BCM5973BCM5973, which is possibly the same chip that Apple used in the 3rd Gen Touch and the iPhone 3G.
[* black] Broadcom BCM5973BCM5973, which is possibly the same chip that Apple used in the 3rd Gen Touch and the iPhone 3G.
[* black] Apple A4