Skip to main content

Changes to Step #6

Edit by iRobot

Pending approval


Step Lines

[* icon_note] It may be necessary to soften the thermal paste between the logic board and heat sink. You can soften the thermal compound using a hairdryer. Move the hairdryer back and forth over the ribbed metal section of the heat sink for one minute. At this point, the heat sink should come free easily.
[* black] Use a spudger to pry the heat sink up on the left side, near the hard drive.

Image 1

No previous image