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Changes to Step #11

Edit by Adam O'Camb

Edit approved by Adam O'Camb

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[* black] We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.
[* black] We immediately notice that this generation's logic board is more ... goopier ... than the [guide|75578|board|stepid=152781|new_window=true] that emerged from the wreckage of the first AirPod fiasco.
[* icon_note] We're guessing this goop over the board is for improved
fiasco—probably to help with water resistance.
[* black] We immediately notice that this generation's logic board is more ... goopier ... than the [guide|75578|board|stepid=152781|new_window=true] that emerged from the wreckage of the first AirPod fiasco.
[* icon_note] We're guessing this goop over the board is for improved
fiasco—probably to help with water resistance.
[* black] Finally, a beacon in the darkness—there's [guide|75578|still|stepid=152780|new_window=true] a modular charging port!
[* black] ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.
[* black] Beneath that shiny liquid-resistant coating, we make out some chips:
[* red] chipsBroadcom
[* orange] New line.
[* yellow] New line.
[* red] chipsBroadcom
[* orange] New line.
[* yellow] New line.

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